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| Category | Requirement Parameter | Buyer Target Value | Units / Options | Criticality / Description |
| MISSION ARCHITECTURE | ||||
| MISSION ARCHITECTURE | Target Orbit Altitude | 500 km | km (e.g., 500 km) | Directly influences ground sampling distance (GSD) |
| MISSION ARCHITECTURE | Orbit Type | LEO | SSO / LEO / Equatorial | Sun-Synchronous Orbit (SSO) is standard for optical imaging |
| MISSION ARCHITECTURE | Local Time of Ascending Node (LTAN) | 10:30 | HH:MM (e.g., 10:30) | Determines solar illumination angles on target areas |
| MISSION ARCHITECTURE | Design Lifetime Target | 5 | Years | Determines radiation shielding and component screening levels |
| OPTICAL & IMAGING PERFORMANCE | ||||
| OPTICAL & IMAGING PERFORMANCE | Panchromatic GSD (Nadir) | 30cm | meters (e.g., 0.3m - 0.5m) | Ground Sampling Distance at lowest point of orbit |
| OPTICAL & IMAGING PERFORMANCE | Multispectral GSD (Nadir) | 50cm - 80cm | meters (e.g., 1.2m - 2.0m) | Typically 4x coarser than Panchromatic band |
| OPTICAL & IMAGING PERFORMANCE | Swath Width | 10km | km (e.g., 10 km - 15 km) | Cross-track imaging coverage width per pass |
| OPTICAL & IMAGING PERFORMANCE | Spectral Bands Required | PAN + MS (6 configurable bands) | Text List (e.g., PAN, R, G, B, NIR) | Define VNIR, SWIR, or Thermal requirements |
| OPTICAL & IMAGING PERFORMANCE | Modulation Transfer Function (MTF) | >10% | Value @ Nyquist (e.g., > 0.15) | Measures image sharpness and optical quality |
| OPTICAL & IMAGING PERFORMANCE | Signal-to-Noise Ratio (SNR) | >200 at 100% albedo | Ratio (e.g., > 150) | Specified at a reference solar radiance level |
| OPTICAL & IMAGING PERFORMANCE | Quantization Bit Depth | 12 | bits (e.g., 12-bit / 14-bit) | Dynamic range and radiometry resolution |
| ELECTRICAL & DATA INTERFACES | ||||
| ELECTRICAL & DATA INTERFACES | Instrument Peak Power | 275 | Watts | Maximum power consumption during imaging operations |
| ELECTRICAL & DATA INTERFACES | Instrument Standby Power | Watts | Power consumed between imaging passes (e.g., thermal maintenance) | |
| ELECTRICAL & DATA INTERFACES | Raw Payload Data Interface Protocol | Spacewire | SpaceWire / SpaceFibre / LVDS / SerDes | High-speed data bus from camera unit to satellite mass memory |
| ELECTRICAL & DATA INTERFACES | Command & Telemetry Interface | RS-422 / MIL-STD-1553 | CAN Bus / RS-422 / I2C / MIL-STD-1553 | Low-speed command link to the main On-Board Computer (OBC) |
| ELECTRICAL & DATA INTERFACES | Payload Core Voltage Supply | 28V regulated | V (e.g., 28V regulated / unregulated) | Spacecraft main power bus compliance standard |
| MECHANICAL, STRUCTURAL & THERMAL | ||||
| MECHANICAL, STRUCTURAL & THERMAL | Payload Maximum Mass Allocated | 130 | kg | Strict ceiling for telescope + focal plane array + electronics |
| MECHANICAL, STRUCTURAL & THERMAL | Maximum Envelope Allocations | 0.5 x 0.5 x 0.85 m | X x Y x Z mm | Volumetric constraints inside launch vehicle fairing |
| MECHANICAL, STRUCTURAL & THERMAL | Optical Alignment Stability | Arcseconds / μrad | Max structural distortion allowed due to thermal gradients | |
| MECHANICAL, STRUCTURAL & THERMAL | Operational Temperature Range | 0°C to 50°C | °C to °C | Narrow thermal windows are often required for optical optics |
| MECHANICAL, STRUCTURAL & THERMAL | Thermal Control Responsibility | Host controlled | Autonomous / Host-controlled | Does payload feature own heaters or rely on platform? |
| PRODUCT ASSURANCE & QUALITY | ||||
| PRODUCT ASSURANCE & QUALITY | Quality Standard Compliance | AS9100 | AS9100 / ECSS / NASA-STD | Space agency or aerospace quality system standard |
| PRODUCT ASSURANCE & QUALITY | Radiation Tolerance (TID) | 30 | krad (Si) | Total Ionizing Dose minimum resilience based on orbit |
| PRODUCT ASSURANCE & QUALITY | Calibration Strategy | Solar | On-board Lamp / Solar / Vicarious | Requirement for radiometric and geometric calibration |
We are a graduate research team in South Korea, developing
a 6U CubeSat for an advanced-track CubeSat competition. We are looking for an
ONBOARD AI PAYLOAD PROCESSOR and would like to gather options and approximate
pricing from multiple suppliers.
Mission summary:
- 6U CubeSat, LEO (~500–600 km)
- Primary mission: optical observation of resident space objects / debris
- Imaging triggered by TLE predictions (event-based capture, no active tracking)
- Onboard AI task: detection + coarse classification of space objects from
captured monochrome images (batch / event-based inference, NOT continuous
real-time processing — so heavy compute is not required)
Requirements / preferences for the AI processor:
- CubeSat-compatible form factor, within ~1U, low power (6U power budget)
- Capable of running a lightweight CNN for detection + coarse classification
- Data interface able to receive images from a monochrome CMOS camera
- Radiation mitigation suitable for a short LEO mission
- LOW COST is a priority — please indicate the most budget-friendly option
and any academic / research / student-competition discount
- Engineering model (EM) availability for ground testing is a plus
For each suggested product, we would like:
1. Approximate unit price (+ academic/research discount if any)
2. Lead time
3. AI performance (TOPS), power consumption, size, mass, interfaces
4. Flight heritage / TRL and radiation-mitigation approach
5. Export-control status for shipping to South Korea
Expected timeline: [launch around 2027 /delivery date]. Quantity: [e.g. 1 EM + 1 FM]
RFQ for Reaction wheels with at least 4Nms momentum storage and max torque of at least 250 mNm
| Category | Parameter | Mission Requirement | Expected Unit / Format | Notes & Testing Conditions |
| Volume | Number of units | 20-50 | pcs | Possibility to scale up if price is good |
| Electrical (AM0) | BOL Efficiency | ≥ 28% (ideally 29–30% | % | Measured at AM0, 28°C |
| EOL Efficiency | ≥ 24% after mission | % | At mission-specific radiation dose | |
| Max Power Voltage (Vmp) | ≥ 2.2 V | V | Measured at AM0, 28°C | |
| Max Power Current (Imp) | As high as possible | mA/cm² or A | Measured at AM0, 28°C | |
| Open-Circuit Voltage (Voc) | ≥ 2.5 V | V | Measured at AM0, 28°C | |
| Short-Circuit Current (Isc) | As high as possible | mA/cm² or A | Measured at AM0, 28°C | |
| Mechanical | Cell Architecture | Triple Junction (GaInP/GaAs/Ge) or high-end IBC Mono Si | Text | e.g., 3J (InGaP/InGaAs/Ge) |
| Cell Dimensions | 40 × 80 mm (±0.5 mm) or similar | mm x mm | Width x Length | |
| CIC Assembly | Coverglass Thickness | 100 – 300 µm | µm or mils | |
| Coverglass Coatings | AR + UV Rejection | Text | e.g., AR, UV Rejection | |
| Interconnect Design | Standard with stress relief | Text | Material and stress relief type | |
| Bypass Diode Type | External Si diode | Text | Monolithic or Discrete | |
| Contact Layout | Front-to-Back or All-Back | Text | e.g., Front-to-Back, All-Back | |
| Heritage & QA | Flight Heritage | LEO preferred | Orbit / Mission List | Proven in LEO/MEO/GEO? |
| Space Standard Auth. | ECSS or equivalent | Text | e.g., ECSS, AIAA | |
| LAT Documentation | Yes | Yes/No | Lot Acceptance Test reports |
1. Educational Satellite Development Kit
• For teaching spacecraft subsystems, embedded systems, communications, power management, and mission operations Qty: 1
2. Single Axis Reaction Wheel Module
• For attitude determination and control experiments
• Compatible with educational satellite platforms Qty: 1
3. Satellite Test Bench – FlatSat Configuration
• Hardware in the loop (HIL) test bench
• For subsystem integration, verification, validation, and FlatSat testing Qty: 1
4. 2U Satellite Structure Expansion Kit
• Modular structure for additional payloads and subsystems Qty: 1
5. Satellite Storage & Transport Case
• Protective case for satellite hardware and accessories Qty: 1
6. Motor Control Development Kit (Dual DC Motors)
• Controls two DC motors
• Uses external power source Qty: 1
7. Microcontroller Based Motor Control Development Kit
• Python programmable
• Wireless IoT connectivity
• Embedded control applications Qty: 1
8. Dual Axis Robotics Educational Kit
• Wireless communication
• 9 DOF IMU
• Ultrasonic distance sensor
• Programmable microcontroller Qty: 2
9. Python Programmable Microcontroller Educational Kit
• Wireless IoT connectivity
• Ultrasonic distance sensor
• Infrared sensing modules
• Plug in expansion capability Qty: 2
| Category | Parameter Name | Target Value | Unit |
| Programmatic | 1. Quantity & Schedule | 1FM asap (<1 Month) | Qty / Date |
| Electrical | 2. Nominal Voltage | 5V,12V | V |
| 3. Total Energy Capacity | 100 | Wh | |
| 4. Max Continuous Current | 5 | A | |
| 5. Peak Current & Duration | 7A for 200ms | A / ms | |
| Mechanical | 6. Maximum Mass | 1.4 | kg |
| 7. Max Envelope (X x Y x Z) | 100x100x200 | mm | |
| Environmental | 8. Operational Temp Range | -45to +65 | °C |
| 9. Launch Vibration (Random) | 5.57 | g rms | |
| Mission Life | 10. Orbit Type & Design Life | LEO, 2 Years | Orbit / Yrs |
| 11. Max Depth of Discharge | 30 | % | |
| Quality | 12. Mission Class / Standard | Space qualified TRL9 |
We need a small solar cell for a distributed lunar science mission. Final mission may need 50-150 of the cells, however we want to understand the pricing and availability of 3J or 4J cells to test and integrate before possible launch. We aim for smaller than 70mm max length, however we may go with an 80 mm by x mm model if needed.
Provision of thermal shock test services (Two-zone elevator thermal shock chamber):
-Device under test:
-6 units of sandwich panels (35 x 16cm x 2cm)
-Test conditions:
-Hot temperature: +115 deg (+-5deg)
-Cold temperature: -110 deg (+-5deg) (flexible, -70deg is the minimum requirement)
-1 min dwell time
-Test cycles:
-Total 30k
-Inspection points:
-One visual inspection after 5k cycles since start
-One visual inspection after 15k cycles since start
-One visual inspection after 30k cycles since start
Expected response to the tender
-Response deadline: 20/07/2026
-Response content:
-FFP price for the mentioned campaign
-If applicable, 2 prices can be quoted, one for the -110 deg temp and another for the -70 deg temp
-Proposed schedule
-Including, at least, 2 days window for a 4h visual inspection
-Thermal shock chamber technical description
-Accommodation of the DUTs (Device Under Test)






















































































